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| 1 motorola sensor device data ! !"$%" ! #$ "$ "##%" # "# the mpx2010/mpxv2010g series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output e directly proportional to the applied pressure. these sensors house a single monolithic silicon die with the strain gauge and thinfilm resistor network integrated on each chip. the sensor is laser trimmed for precise span, offset calibration and temperature compensation. features ? temperature compensated over 0 c to +85 c ? ratiometric to supply voltage ? differential and gauge options application examples ? respiratory diagnostics ? air movement control ? controllers ? pressure switching figure 1 shows a block diagram of the internal circuitry on the standalone pressure sensor chip. figure 1. temperature compensated and calibrated pressure sensor schematic + ( ( #( # ! " #) ) # !" ) "% ')*' $"% #() $# # ! ') $# '* )'.
+ 587 + 587 # voltage output versus applied differential pressure the output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (p1) relative to the vacuum side (p2). similarly, output voltage increases as increasing vacu- um is applied to the vacuum side (p2) relative to the pressure side (p1). preferred devices are motorola recommended choices for future use and best overall value. order this document by mpx2010/d
semiconductor technical data ? motorola, inc. 2002 small outline package surface mount unibody package mpx2010gp case 344b MPX2010GSX case 344f pin number note: pin 1 is noted by the notch in the lead. 1 2 3 gnd +v out v s 5 6 7 n/c n/c n/c 4v out 8 n/c mpx2010d case 344 mpx2010dp case 344c mpx2010gs case 344e mpxv2010dp case 1351 mpxv2010gp case 1369
compensated pressure sensor 0 to 10 kpa (0 to 1.45 psi) full scale span: 25 mv motorola preferred device pin number 1 2 gnd +v out 3 4 v s v out note: pin 1 is noted by the notch in the lead. rev 9 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 2 motorola sensor device data maximum ratings (note) rating symbol value unit maximum pressure (p1 > p2) p max 75 kpa storage temperature t stg 40 to +125 c operating temperature t a 40 to +125 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s = 10 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristic symbol min typ max unit pressure range (1) p op 0 e 10 kpa supply voltage (2) v s e 10 16 vdc supply current i o e 6.0 e madc full scale span (3) v fss 24 25 26 mv offset (4) v off 1.0 e 1.0 mv sensitivity d v/ d p e 2.5 e mv/kpa linearity (5) e 1.0 e 1.0 %v fss pressure hysteresis (5) (0 to 10 kpa) e e 0.1 e %v fss temperature hysteresis (5) (40 c to +125 c) e e 0.5 e %v fss temperature effect on full scale span (5) tcv fss 1.0 e 1.0 %v fss temperature effect on offset (5) tcv off 1.0 e 1.0 mv input impedance z in 1000 e 2550 w output impedance z out 1400 e 3000 w response time (6) (10% to 90%) t r e 1.0 e ms warmup e e 20 e ms offset stability (7) e e 0.5 e %v fss notes: 1. 1.0 kpa (kilopascal) equals 0.145 psi. 2. device is ratiometric within this specified excitation range. operating the device above the specified excitation range may i nduce additional error due to device selfheating. 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. 5. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation at full rated pressure over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 7. offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 3 motorola sensor device data onchip temperature compensation and calibration figure 2. output versus pressure differential " # ).% $ ( ) ).% $*)%*)4+21 3%/ %( / "- (%# '# ).% + ( +21 ) % % figure 2 shows the output characteristics of the mpx2010/mpxv2010g series at 25 c. the output is direct- ly proportional to the differential pressure and is essentially a straight line. the effects of temperature on full scale span and offset are very small and are shown under operating characteristics. this performance over temperature is achieved by having both the shear stress strain gauge and the thinfilm resistor circuitry on the same silicon diaphragm. each chip is dynam- ically laser trimmed for precise span and offset calibration and temperature compensation. figure 3. unibody package e crosssectional diagram (not to scale) ( ! $# $) , ' $# ! '" () #! (( () ! " )! $+ ' %$-. ( ')+ $# % % figure 3 illustrates the differential/gauge die in the basic chip carrier (case 344). a silicone gel isolates the die surface and wire bonds from the environment, while allowing the pres- sure signal to be transmitted to the silicon diaphragm. the mpx2010/mpxv2010g series pressure sensor oper- ating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. me- dia other than dry air may have adverse effects on sensor performance and long term reliability. contact the factory for information regarding media compatibility in your application. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 4 motorola sensor device data linearity linearity refers to how well a transducer's output follows the equation: v out = v off + sensitivity x p over the operating pressure range. there are two basic methods for calculating nonlinearity: (1) end point straight line fit (see figure 5) or (2) a least squares best line fit. while a least squares fit gives the abest caseo linearity error (lower numerical value), the calculations required are burdensome. conversely, an end point fit will give the aworst caseo error (often more desirable in error budget calculations) and the cal- culations are more straightforward for the user. motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. figure 4. linearity specification comparison ! () (&*' + ) $# ' !) + +$!) $*)%*) %' ((*' *!!(! # %$ #) ()' ) ! # ) - ') % ' $'"# *'+ ! () (&*' ( ) ()' ) ! # + ) $# $ ( ) pressure (p1)/vacuum (p2) side identification table motorola designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing silicone gel which isolates the die from the environment. the motorola mpx pressure sensor is designed to operate with positive differen- tial pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: part number case type pressure (p1) side identifier mpx2010d 344 stainless steel cap mpx2010dp 344c side with part marking mpx2010gp 344b side with port attached mpx2010gs 344e side with port attached MPX2010GSX 344f side with port attached mpxv2010gp 1369 side with port attached mpxv2010dp 1351 side with part marking ordering information e unibody package (mpx2010 series) mpx series device type options case type order number device marking basic element differential 344 mpx2010d mpx2010d ported elements differential, dual port 344c mpx2010dp mpx2010dp gauge 344b mpx2010gp mpx2010gp gauge, axial 344e mpx2010gs mpx2010d gauge, axial pc mount 344f MPX2010GSX mpx2010d ordering information e small outline package (mpxv2010g series) device type options case no. mpx series order no. packing options marking ported elements gauge, side port, smt 1369 mpxv2010gp trays mpxv2010g differential, dual port, smt 1351 mpxv2010dp trays mpxv2010g f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 5 motorola sensor device data small outline package dimensions case 136901 issue o d e e/2 n e " a e1 a b c b detail g p #$) ( $#)'$!! # " #( $# # #) '%' ) " #( $#( # )$! '# ( % ' (" . " " #( $#( # $ #$) #!* "$! !( $' %'$)'*( $#( "$! !( $' %'$)'*( $#( ( !! #$) - % ' ( " #( $# 0 $ ( #$) #!* "' %'$)'*( $# !!$,! "' %'$)'*( $# ( !! "- "*" ! " ( ( f k m detail g l a1 q .014 (0.35) q t ? ( ( f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 6 motorola sensor device data small outline package dimensionsecontinued case 135101 issue o d e e/2 n e " a e1 a b c b detail g p #$) ( $#)'$!! # " #( $# # #) '%' ) " #( $#( # )$! '# ( % ' (" . " " #( $#( # $ #$) #!* "$! !( $' %'$)'*( $#( "$! !( $' %'$)'*( $#( ( !! #$) - % ' ( " #( $# 0 $ ( #$) #!* "' %'$)'*( $# !!$,! "' %'$)'*( $# ( !! "- "*" ! " ( ( f k m t ? detail g l a1 q .014 (0.35) q ().! % # # +587 +6 +587 # # # # ().! % # # +6 # +587 # # # # f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 7 motorola sensor device data unibody package dimensions case 34415 issue z ().! % # '$*# $*)%*) (*%%!. $*)%*) ().! % # + (*%%!. (*%%!. '$*# " " ) pin 1 r n l g f d 4 pl t c m j b a ( ( #$" #$" #$) ( " #( $# # # )$! '# # % ' (" . " $#)'$!! # " #( $# # " #( $# ( #!*( + $ ) "$! ()$% ' # "$! ()$% ' # #$) )$ - ().! % # # +$*) +( +$*) dambar trim zone: f this is included within dim. afo 8 pl y z case 344b01 issue b ().! % # '$*# $*)%*) (*%%!. $*)%*) b n r c j t d f u h l port #1 positive pressure pin 1 a q s k g 4 pl p ( & " ) ( ( " & ( ) #$) ( " #( $# # # )$! '# # % ' #( . $#)'$!! # " #( $# # ( ( ( ( (p1) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 8 motorola sensor device data unibody package dimensions e continued case 344c01 issue b ().! % # '$*# $*)%*) (*%%!. $*)%*) port #2 port #1 port #2 vacuum k s w h l u f g d port #1 positive pressure q pin 1 4 pl p t t ( & " ) ( ( " & ( ) b n j c v r #$) ( " #( $# # # )$! '# # % ' #( . " $#)'$!! # " #( $# # ( ( ( ( a (p2) (p1) case 344e01 issue b ().! % # '$*# $*)%*) (*%%!. $*)%*) s #$) ( " #( $# # # )$! '# # % ' #( . " $#)'$!! # " #( $# # ( ( back side vacuum pin 1 4 pl port #1 positive pressure k a g f d " " ) c n r v j b t (p1) (p2) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 9 motorola sensor device data unibody package dimensions e continued case 344f01 issue b #$) ( " #( $# # # )$! '# # % ' #( . " $#)'$!! # " #( $# # ().! % # '$*# + $*) + (*%%!. + $*) e c j v t port #1 positive pressure pin 1 4 pl d p g k " & " ) u a f s n b ( % " & ( ) ( ( q r (p1) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 10 motorola sensor device data notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 11 motorola sensor device data notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 12 motorola sensor device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, representation o r guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the applicati on or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for e ach customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications int ended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or dea th may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its o fficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleg es that motorola was negligent regarding the design or manufacture of the part. motorola and the stylized m logo are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. motorola and the stylized m logo are registered in the us patent & t rademark office. all other product or service names are the property of their respective owners. motorola, inc. 2002. how to reach us: usa/europe/locations not listed : motorola literature distribution; p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 japan : motorola japan ltd.; sps, technical information center, 3201, minamiaz abu. minatoku, tokyo 1068573 japan. 8 1334403569 asia/pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2 dai king street, tai po industrial estate, tai po, n.t., hong ko ng. 85226668334 technical information center: 18005216274 home page : http://www.motorola.com/semiconductors/ mpx2010/d ? f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . |
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